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1. Number of temperature control
segments: 1-128; up to 8*16 segments of program can be set and stored in the
reflow soldering machine according to practical needs.
2. Number of temperature zones: Single
zone with multiple temperature segment control.
3. Temperature control system: Automatic
temperature control using microcomputer; non-contact SSR output.
4. Accuracy of temperature: ±1°C.
5. Temperature rise time: 90s to enter
into temperature keeping zone.
6. Temperature range: Room temperature
to 300°C.
7. Heat source: Infrared + hot air
convection.
8. Effective area of work bench:
350mm*250mm (larger than A4 paper), on which maximum size 350mm*250mm of PCB
can be put.
9. Soldering time: 6min±1min.
10.
Temperature curve: 1-8 pieces of temperature curve can be set in the reflow
soldering machine according to needs. User can select the temperature curve
according to the accuracy for product soldering. There are four default pieces
of curve, e.g. leaded, lead-free, cure etc. in the machine for selection. Cure
1: about 90s for temperature keeping at 150°C; cure 2: about 5 min for
temperature keeping at 150°C.
11. Cooling system: Cross-flow type
balanced rapid cooling.
12. Rated voltage: Single phase AC 220V, 50Hz/60Hz.
13. Rated power: 4.2KW; average power:
1.5kW.
15. Separate air exhausting duct for
cooling: The ON/OFF of air duct is automatically controlled through the
electric controlled door to effectively ensure the airtightness of hot room.
16. Weight: 45kg.
17. Outside dimensions: 620(L)*460(W)*385(H)mm.
18. External RS232 interface, input of
K-type thermocouple, drive for solid state relay, cooling signal and ringing
signal.
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